Exhibition Invitation
The 8th Global Semiconductor Industry Expo (Chongqing), GSIE 2026, will be held from May 13 to 15, 2026, at Chongqing International Expo Center. The exhibition covers integrated circuit manufacturing, packaging and testing, semiconductor materials, and production equipment.
LightE sincerely invites you to visit Booth A123-1 in Hall S1 to discuss semiconductor precision inspection and high-end optical measurement technology.
Products on Display
For semiconductor inspection pain points, LightE will present high-precision chromatic confocal displacement sensors that support non-contact displacement, thickness, flatness, and height-difference measurement.
Typical applications include wafer thickness and TTV, wafer warpage, surface flatness, multilayer film thickness, solder ball coplanarity, package height, and precision assembly inspection.
On-site Support
LightE’s technical team will provide product demonstrations, application consultation, and measurement solution recommendations. We look forward to working with customers and partners to build a stronger semiconductor inspection ecosystem.
