Wafer warpage online detection

Wafers are prone to warping due to thermal stress and material differences during the manufacturing process, which affects subsequent handling, exposure, and lamination processes. It is difficult to detect abnormalities in time using traditional spot inspection methods. LightE uses a high-precision displacement measurement solution to conduct non-contact scanning of the wafer surface profile, quickly obtain warpage data, and help customers adjust process parameters in a timely manner during the process.